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Redesigning CMOS Electronics: What, Why and How?

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KAUST

A little more than half of the world’s population enjoy benefits of information technology which is enabled by complementary metal oxide semiconductor (CMOS) electronics. Going forward, we will enjoy further augmentation of quality of life through integrated CMOS electronic systems consisting of logic, memory, communication devices, energy storage and harvester, power management units, sensors and actuators. Their main attributes will include but not limited to high performance and storage capacity for data management; seamless connectivity; energy efficiency; hyper-scale integration density; appropriate functionalities based on their applications and operational environment; reliability and safety; and finally affordability and simplicity to expand their user base to include those who do not have any access to them today. Even using last fifty years’ wealth of knowledge and experience, such integrated electronic system development and deployment is a monumental engineering challenge. From that perspective, redesigning CMOS electronics might seem to be an overly ambitious goal specially, if that means transformation of such physically rigid complex electronic systems into a fully flexible one. To address this intriguing challenge, we have developed a unique coin like architecture based soft singular platform, which can be used as the building block of standalone fully flexible CMOS electronic system with all the aforementioned characteristics. We have devised an effective heterogeneous integration strategy based on mature and reliable CMOS technology only to integrate hybrid materials and diverse set of devices for multi-disciplinary applications. These will be the focus of this talk.
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Flexible, Wearable, Disposable Wireless Communication and Sensing Systems Through Additive Manufacturing - 2020

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KAUST

With the advent of wearable sensors and internet of things (IoT), there is a new focus on electronics which can be bent so that they can be worn or mounted on non-planar objects. Due to large volume (billions of devices), there is a requirement that the cost is extremely low, to the extent that they become disposable. The flexible and low-cost aspects can be addressed through additive manufacturing technologies such as inkjet, screen and 3D printing. This talk introduces additive manufacturing as an emerging technique to realize low cost, flexible and wearable wireless communication and sensing systems. The ability to print electronics on unconventional mediums such as plastics, papers, and textiles has opened up a plethora of new applications. In this talk, various innovative antenna and sensor designs will be shown which have been realized through additive manufacturing. A multilayer process will be presented where dielectrics are also printed in addition to the metallic parts, thus demonstrating fully printed components. Many new functional inks and their use in tunable and reconfigurable components will be shown. In the end, many system level examples of wireless sensing applications will be shown. The promising results of these designs indicate that the day when electronics can be printed like newspapers and magazines through roll-to-roll and reel-to-reel printing is not far away.
<> Sensor Fusion (1)